MIC Analyzes Power Component and Advanced Packaging Upgrades Driven by AI and Physical AI
Frontier AI models
Taiwan's MIC reports that AI compute and Physical AI push data centers toward 800V HVDC, driving SiC and GaN module adoption while steering IDMs toward 2.5D and 3D advanced packaging integration.
Taiwan's MIC stated that surging AI compute and edge deployments are driving power device and packaging upgrades. Data centers adopting 800V HVDC architectures demand higher efficiency, steering SiC and GaN into integrated power modules. Concurrently, divergent demands between cloud performance and edge power limits are accelerating IDM shifts toward chiplets and 2.5D/3D packaging integration.
Key takeaways
- AI compute and Physical AI require higher power specs, pushing SiC and GaN toward integrated power modules.
- Divergent cloud and edge demands drive IDM strategy shifts and accelerate chiplet and 2.5D/3D packaging integration.
Source：EE Times Taiwan 電子工程專輯 Read the original ↗
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